| - Installed Systems Examples - |
| Fixtured Systems |
A. High-Voltage Computer Backplane Testing
1,000 Volt Testing of 80,000 test point
mainframe backplanes at IBM |
B. Step and Repeat Testing of Complex PCB's
60,000 Test Points on 0.020 IN. (0.5 MM)
Pitch for Testing Inner Layers and
Composites at Cray Research |
C. Chip Carrier Test System
16,384 Test Point System for Testing
Chip Carriers at 3M |
- Top and bottom test heads.
- Probing pitches down to 150 microns (0.006 in.)
D. Multi-Chip Module Test System
Step and repeat test system for
multi-chip module testing at IBM |
- Step and repeat top heads with 40,000 test points.
- Bottom test head with 20,000 test points.
- 5 micron head positioning accuracy.
- 1 micron head positioning resolution.
- Product mapping to compensate for manufacturing distortions.
- Probing pitches down to 100 microns (0.004 in.)
E. Ceramic Substrate Test System
Ceramic Substrate Testing. Built
for Kanematsu in Japan |
F. Glass Panel Probing
High density probing of glass panels. Built for Dupont. |
G. Step and Repeat Testing of Large PCB's
Testing 68 layer PCB's with
172,032 nodes at Fujitsu. |
- 2 stepping test heads with 16,384 test points each.
- Test heads programmable in 1 micron steps.
- Insulation resistance testing at 250 VDC, 100 megohms.
H. Top / Bottom Head PCB Test System
65,536 Top / 65,536 Bottom Head PCB
Test
System For Cray Research |
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